JPS64270Y2 - - Google Patents
Info
- Publication number
- JPS64270Y2 JPS64270Y2 JP4119183U JP4119183U JPS64270Y2 JP S64270 Y2 JPS64270 Y2 JP S64270Y2 JP 4119183 U JP4119183 U JP 4119183U JP 4119183 U JP4119183 U JP 4119183U JP S64270 Y2 JPS64270 Y2 JP S64270Y2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- polishing
- chuck
- measured
- measuring needle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005498 polishing Methods 0.000 claims description 29
- 239000000523 sample Substances 0.000 claims description 9
- 235000012431 wafers Nutrition 0.000 description 35
- 238000005259 measurement Methods 0.000 description 8
- 230000002950 deficient Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4119183U JPS59148251U (ja) | 1983-03-21 | 1983-03-21 | ウエハプロ−バの測定針研磨装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4119183U JPS59148251U (ja) | 1983-03-21 | 1983-03-21 | ウエハプロ−バの測定針研磨装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59148251U JPS59148251U (ja) | 1984-10-03 |
| JPS64270Y2 true JPS64270Y2 (en]) | 1989-01-06 |
Family
ID=30171785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4119183U Granted JPS59148251U (ja) | 1983-03-21 | 1983-03-21 | ウエハプロ−バの測定針研磨装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59148251U (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2711855B2 (ja) * | 1988-06-13 | 1998-02-10 | 東京エレクトロン株式会社 | プローブ装置および検査方法 |
-
1983
- 1983-03-21 JP JP4119183U patent/JPS59148251U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59148251U (ja) | 1984-10-03 |
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